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HPL Technologies IncProposed Symbol - Nasdaq: HPLA

Address:
2033 Gateway Place Suite 400
  San Jose, California 95110
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IPO Information as of 4-Sep-08
Offering Information
Expected Date-
Proposed Exchange/Ticker Nasdaq: HPLA
Security Type Common Stock
Lead Underwriter UBS Warburg
Days In Registration 62
Date Filed 29-May-2001
Form FiledS-1
Fundamentals
(Year Ending December 2007)
Industry Pers/Bus/Rep Svc
Business Description Develop yield-optimization software that enables semiconductor companies to enhance the efficiency of the semiconductor production process. Products include a flexible software platform supported by over 600 software modules that allows customers to accelerate the process in which they identify, measure and correct sources of failure in the production process
Revenue -
Net Income -
Shares Outstanding (post-offering) 23.83M
President & CEO Y. DAVID LEPEJIAN
Number of Employees 244
Original Filing Information

US
Shares Filed 6.0M
Secondary Shares Filed-
  · As a Percent -
Primary Shares Filed 6.0M
  · As a Percent 100.0
Overallotment Shares Filed 900.0K
File Amount $66.0M
File Price Range $12.00 - $10.00
File Mid Price $11.00
Current Filing Information
(Amended 30-Jul-2001)

US
Shares Filed 6.0M
Secondary Shares Filed -
  · As a Percent -
Primary Shares Filed 6.0M
  · As a Percent 100.0
Overallotment Shares Filed -
File Amount $66.0M
  · % Change from Original 0.0
File Price Range $12.00 - $10.00
File Mid Price $11.00


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