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Pointing out faults may be a petty habit in social circles, but it's actually an august task in semiconductor production. August Technology's automated inspection equipment -- especially its flagship NSX micro defect inspection system -- helps chip makers improve their production yield by finding tiny flaws in semiconductor wafers. Its 3Di wafer bump inspection systems carry out similar defect-diagnosis tasks during the process of microchip packaging. August had agreed to merge with Nanometrics, a supplier of semiconductor metrology tools, but received competing bids from rivals Rudolph Technologies and KLA-Tencor. The company has been acquired by Rudolph for about $193 million in cash and stock.
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Address: |
4900 W. 78th St. Bloomington, MN 55435
| | Phone: | 952-820-0080 | | Fax: | 952-820-0060 |
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| Financial
Highlights | | Fiscal Year End: | December |
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Key People
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Chairman and CEO:
Jeff L. O'Dell
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President, COO, and Director:
Lynn J. Davis
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CFO, Treasurer, and Assistant Secretary:
Stanley D. (Stan) Piekos
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