On February 5, 2013, MagnaChip Semiconductor Corporation (the "Company") issued the press release attached as Exhibit 99.1 to this Current Report on Form 8-K, announcing the pricing of the secondary offering of the Company's common stock by certain of its stockholders.

The information disclosed under this Item 7.01, including Exhibit 99.1 hereto, shall not be deemed "filed" for purposes of Section 18 of the Securities Exchange Act of 1934, as amended, and shall not be deemed incorporated by reference into any filing made under the Securities Act of 1933, as amended, except as expressly set forth by specific reference in such filing.

The Company is filing herewith an Underwriting Agreement, dated February 5, 2013, by and among the Company, the stockholders named therein and Barclays Capital Inc., Deutsche Bank Securities Inc., Citigroup Global Markets Inc. and UBS Securities LLC, as representatives of the several Underwriters, as an exhibit to its Registration Statement on Form S-3 (Registration No. 333-180695).

(d) Exhibits.

Exhibit
  No.                                     Description

 1.1         Underwriting Agreement, dated February 5, 2013, by and among MagnaChip
             Semiconductor Corporation, the stockholders named therein and Barclays
             Capital Inc., Deutsche Bank Securities Inc., Citigroup Global Markets
             Inc. and UBS Securities LLC, as representatives of the several
             Underwriters.

99.1         Press release for MagnaChip Semiconductor Corporation dated February
             5, 2013, announcing the pricing of a secondary offering.